TIM-Tester – Vespel – Thermal conductivity, Thermal Impedance in Polymers

Thermal Conductivity

Vespel™ stands as a high-performance polymer engineered to excel under extreme conditions, whether subjected to severe thermal, electrical, or mechanical stresses. It boasts an impressive array of properties, including exceptional dimensional and thermal stability, low thermal and electrical conductivity, excellent wear and bearing capabilities, and remarkable resistance to chemicals and radiation.

What further distinguishes Vespel is its capacity to render numerous components both lighter and more resilient when compared to traditional metals, ceramics, and polymers. Consequently, Vespel finds widespread application, particularly in industries like aerospace, semiconductor technology, and automotive engineering.

App. Nr. 02-001-001 TIM-Tester – Vespel – Thermal conductivity, Thermal Impedance

The presented plot illustrates a thermal impedance measurement conducted on a 25mm x 25mm Vespel sample at 50°C (with a hot-side temperature of 70°C and a cold-side temperature of 30°C) under a contact pressure of 1 MPa. The measurements involved three different samples, each with varying thickness (ranging from 1.1 mm to 3.08 mm), allowing for the determination of thermal conductivity and thermal contact resistance through linear regression, as depicted in the graph. The measured thermal conductivity, the reciprocal of the slope, was determined to be 0.35 W/mK, with the thermal contact resistance represented by the offset on the Y-Axis.

Related instruments


The LINSEIS TIM-Tester (Thermal Interface Material Tester) measures the thermal impedance of sample materials and identifies an apparent thermal conductivity for a wide range of materials

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